MT8735晶片平臺設計資料參考

MT8735 Platform Thermal Design Notices

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Thermal Strategy on MT8735 Platform：

Thermal Consideration on Phone Design

– For slim phone, hot spot on phone surface was obviously. Apply heat spreader material on back cover of phone or panel side can help to mitigate hot spot on phone surface. Suggest to make heat spreader design in on phone thickness < 10mm. (copper foil, graphite are heat spreader material)

– Requirement for phone thickness was less than 8mm, metal-frame design was recommended for design. Al-mg alloy is popular design for application. It had good thermal performance and strength for phone design.

– MT8735 is FCCSP type package, to plan heat transfer on top side of package is an important thermal strategy for design.

– Apply TIM for thermal design, spreader type shielding case must be applied for design. 

– Attach TIM between AP top side and shielding case was good design for thermal performance. TIM was recommended for MT8735 thermal design.

– In MT8735 platform, PCB size is a key factor for release AP performance. Suggest PCB size must be large than 3000 mm2 for design.

– Small PCB will suffer AP performance. If PCB area is less than recommending area 3000mm2, high performance thermal solution must to be added for cover performance gap in PCB size.

Thermal design list for MT8735 performance target

– To plan cooling path on AP top and bottom side is very important. 

     AP bottom side : PCB area is mainly cooling solution (If PCB area was less than 3000mm2, please add thermal solution on PCB back side for thermal improvement)

     AP top side : Add TIM between AP & shielding case

– Heat spreader material applied on MT8735 for mitigating hot spot on phone surface

     Attach Cu foil or graphite increase in-plan thermal performance and eliminate hot spot in panel.

     Attach graphite on back cover will be help to mitigate hot spot on phone surface.

– Boldface item will affect AP performance obviously.

Thermal Strategy for MT8735

– Heat transfer path 1 : Can attach TIM between top side of package and shielding cover. Separation type of shielding case must be applied for TIM design

– Heat transfer path 2: To add copper foil between shielding cover and metal frame. It can improve in-plan thermal performance and make uniform temperature distribution. (PCB area <3000mm2 was recommended)

– Apply heat spreader material for mitigate hot spot of phone surface. (0.1mm copper foil or synthetic graphite)

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