MTK MT8788處理器引數規格介紹
General
-- Tablet, two MCU subsystems architecture
-- Supports eMMC/uFS boot
-- Supports LPDDR3
-- Supports LPDDR4X
AP MCU subsystem
-- Quad-core ARM® 2.0GHz Cortex-A73 MPCoreTM with 64KB L1 I-cache, 64KB L1 D-cache and 1MB unified L2 cache
-- Quad-core ARM® 2.0GHz Cortex-A53 MPCoreTM with 32KB L1 I-cache, 32KB L1 D-cache and 1MB unified L2 cache
-- NEON multimedia processing engine with SIMDv2/VFPv4 ISA support
-- DVFS technology with adaptive operating voltage from 0.6V to 1.12V
MD MCU subsystem
-- Imagination MIPS32® InterAptive processor with max. 864MHz operation frequency
-- High-performance multi-core and multithread processor architecture (two cores and two threads)
-- 32KB L1 I-cache and 32KB L1 D-cache per core
-- 384KB SPRAM (Scratchpad memory, Two-Core’s ISPRAM and DSPRAM)
-- 256KB L2 Cache (share L2 cache for two cores)
-- High-performance AXI bus Interfaces
-- Power management for clock gating control
-- FD216 DSP for running GSM modem with max. 312MHz operation frequency
MD external interfaces
-- Dual SIM/USIM interface
Interface pins with RF and radio-related peripherals (antenna tuner, PA, etc.)
Security
-- ARM® TrustZone® Security
External memory interface
-- LPDDR3 up to 4GB (single channel with 32-bit data bus width)
-- LPDDR4X up to 8GB (dual channels with 16-bit data bus width)
-- Memory clock up to LPDDR3-1866 or LPDDR4X-3600
-- Self-refresh/partial self-refresh mode
-- Low-power operation
-- Programmable slew rate for memory controller’s IO pads
-- Dual rank memory device
-- Advanced bandwidth arbitration control
Peripherals
-- USB one port with USB3.0 device mode or USB2.0 OTG mode
-- eMMC5.1
-- uFS 2.1
-- 3 UART for debugging and applications
-- 6 SPI masters for external devices
-- 6 I2C/3 I3C to control peripheral devices, e.g. CMOS image sensor, LCM or FM receiver module
-- Max. 3 PWM channels (depending on system configuration/IO usage)
-- I2S for connection with optional external hi-end audio codec
-- GPIOs
-- 2 sets of memory card controllers supporting SD/SDHC/MS/MSPRO/MMC and SDIO2.0/3.0 protocols
Operating conditions
-- Core voltage: 0.7V/0.8V
-- I/O voltage: 1.8V/2.8V/3.3V
Memory: 1.1V/0.6V
-- LCM interface: 1.8V
-- Clock source: 26MHz, 32.768kHz
Package
-- Type: VFBGA
-- 11.8mm*11.0mm
-- Height: Max. 0.9mm
-- Ball count: 599 balls
-- Ball pitch: 0.4mm
LTE
-- FDD/TDD Up to 300Mbps downlink, 150Mbps uplink
-- Downlink carrier aggregation (CA) ability; 1.4 to 20MHz RF bandwidth per component carrier (CC) and up to 2 CCs
-- 8*2 downlink SU-MIMO per component carrier
-- Downlink MU-MIMO per component carrier
-- Supports feICIC
-- Supports MBMS
-- Uplink CoMP ability
-- Advanced Interference Cancellation
-- Transmit Atenna Selection
3G UMTS FDD supported features
-- 3G modem supports most main features in 3GPP Release 7 and Release 8
-- CPC (DTX in CELL_DCH, UL DRX DL DRX), HS-SCCH-less, HS-DSCH
-- Dual cell operation
-- MAC-ehs
-- 2 DRX (receiver diversity) schemes in URA_PCH and CELL_PCH
-- Uplink Cat. 7 (16QAM), throughput up to 11.5Mbps
-- Downlink Cat. 24 (64QAM, dual-cell HSDPA), throughput up to 42.2Mbps
-- Fast dormancy
-- ETWS
-- Network selection enhancements
-- Transmit Atenna Selection
TD-SCDMA
-- CDMA/HSDPA/HSUPA baseband
-- TD-SCDMA Bands 34, 39 & 40 and Quad band GSM/EDGE
-- Circuit-switched voice and data; packet switched data
384/384Kbps class in UL/DL for TD SCDMA
-- TD-HSDPA: 2.8Mbps DL (Cat.14)
-- TD-HSUPA: 2.2Mbps UL (Cat.6)
-- F8/F9 ciphering/integrity protection
-- Transmit Atenna Selection
Radio interface and baseband front end
-- High dynamic range delta-sigma ADC converts the downlink analog I and Q signals to digital baseband.
-- 10-bit D/A converter for Automatic Power Control (APC)
-- Programmable radio Rx filter with adaptive gain control
-- Dedicated Rx filter for FB acquisition
-- Baseband Parallel Interface (BPI) with programmable driving strength
-- Supports multi-band
GSM modem and voice CODEC
-- Dial tone generation
-- Noise reduction
-- Echo suppression
-- Advanced side-tone oscillation reduction
-- Digital side-tone generator with programmable gain
-- 2 programmable acoustic compensation filters
-- GSM quad vocoders for adaptive multi rate (AMR), enhanced full rate (EFR), full rate (FR) and half rate (HR)
-- GSM channel coding, equalization and A5/1, A5/2 and A5/3 ciphering
-- GPRS GEA1, GEA2 and GEA3 ciphering
-- Programmable GSM/GPRS/EDGE modem
-- Packet switched data with CS1/CS2/CS3/CS4 coding schemes
-- GSM circuit switch data
-- GPRS/EDGE Class 12
CDMA2000 modem interfaces
-- Supports CDMA2000 1xRTT (releases 0) and CDMA2000 HRPD/1xEV-DO Revision 0 and A
-- Supports maximum 1x data rates of 153.6kbps for forward and reverse links and DO data rates of 3.1Mbps for forward link and 1.8Mbps for reverse link
-- Hybrid operation between 1x and HRPD
-- Simultaneous Hybrid Dual Receiver (SHDR) support
-- Supports 1x Diversity
-- Supports SRLTE
-- Transmit Atenna Selection
---------------------
注:可參考MT8788規格書()資料
來自 “ ITPUB部落格 ” ,連結:http://blog.itpub.net/31529038/viewspace-2642122/,如需轉載,請註明出處,否則將追究法律責任。
相關文章
- MT8788晶片怎麼樣?MT8788處理器介紹晶片
- MT6162處理器引數,MT6162晶片規格介紹晶片
- MTK晶片資料大全,MTK處理器型號介紹晶片
- 龍芯1A處理器引數介紹
- 龍芯2H晶片處理器引數效能介紹晶片
- 高通驍龍850處理器引數詳細介紹
- 瑞芯微RK3328晶片處理器引數介紹晶片
- MT8735處理器引數,MT8735晶片介紹晶片
- JZ4775晶片引數怎麼樣?JZ4775處理器引數介紹晶片
- MT6179+MT6176處理器規格/晶片引數比較晶片
- 最全MTK處理器型號/聯發科晶片平臺資料介紹晶片
- 海思Hi3798CV200處理器主要效能引數介紹
- MT7603E/MT7603U處理器,MTK晶片系列資料介紹晶片
- MT7603 wifi晶片模組,MT7603處理器引數介紹WiFi晶片
- 高通驍龍410e/APQ8016E處理器引數介紹
- MT7682晶片手冊資料, MT7682處理器引數介紹晶片
- 海思Hi3798模組晶片,Hi3798處理器引數介紹晶片
- 海思Hi3136衛星數字電視通道接收晶片處理器引數介紹晶片
- RK281x晶片怎麼樣?RK281x處理器引數介紹晶片
- 全志A10s處理器怎麼樣?A10s晶片引數介紹晶片
- MT6589四核單晶片資料,MT6589處理器引數介紹晶片
- 海思hi3559AV100開發板引數規格介紹
- RAW數碼照片處理器:SILKYPIX Developer 的功能介紹Developer
- MT8788基帶晶片規格書,MT8788資料手冊晶片
- J302βγ蓋格計數管規格介紹說明
- 聯發科MT6737 datasheet,MT6737晶片手冊,MT6737處理器引數介紹晶片
- jmeter引數化介紹JMeter
- 龍芯1D晶片處理器介紹晶片
- 龍芯1B晶片處理器介紹晶片
- MT6177晶片資料/處理器介紹晶片
- MT6771晶片資料/處理器介紹晶片
- MyBatis 引數處理MyBatis
- 聯發科MT5582數字電視晶片處理器介紹晶片
- 榮耀earbuds3pro怎麼樣值得入手嗎 音質引數規格介紹S3
- Hi3796M V200晶片處理器介紹晶片
- 聯發科平板晶片,MT8163處理器介紹晶片
- MT6735晶片介紹,聯發科6735處理器晶片
- 高通855plus晶片資料規格引數CPU簡介晶片