高通855plus晶片資料規格引數CPU簡介

 高通®Snapdragon™855移動平臺是為速度和尖端效能而建立的。 提供更快的圖形渲染和提高CPU效能從標準Snapdragon855，y你會看到並感受到每一齣戲的提振。 這一超強大的平臺利用多千兆4G連線，同時向世界釋放尖端的5G體驗。

更多高通855plus資料搜尋一牛網論壇

Qualcomm® Artificial Intelligence Engine

• Qualcomm® Hexagon™ 690 Processor 

• Qualcomm® Hexagon™ Vector Accelerator

• Qualcomm® Hexagon™ Tensor Accelerator

• Qualcomm® Hexagon™ Voice Assistant

• Qualcomm® All-Ways Aware™ Hub

• Qualcomm® Adreno™ 640 GPU 

• Qualcomm® Kryo™ 485 CPU

5G Modem

• Snapdragon™ X50 5G Modem

• Supported Technologies: 5G NR

• Support for sub-6 GHz and mmWave

• Supported Spectrum:

• mmWave: 800 MHz bandwidth, 8 carriers, 

2x2 MIMO

• Sub-6 GHz: 100 MHz bandwidth, 4x4 MIMO

4G Modem 

• Snapdragon™ X24 LTE modem

• Cellular Technologies: LTE FDD, LTE TDD with 

CBRS support, LAA, LTE Broadcast, WCDMA, 

TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE 

• Downlink: LTE Cat 20 up to 2.0 Gbps, 7x20 

MHz carrier aggregation, 256-QAM, 4x4 MIMO 

on five carriers

• Uplink: LTE Cat 13 up to 318 Mbps, 3x20 MHz 

carrier aggregation, 256-QAM, Uplink Data 

Compression

• Multi SIM with support for Dual SIM Dual 

VoLTE (DSDV) and LTE Dual SIM Dual Standby 

(DSDS) +LAA

• Next-generation Calling Services including 

VoLTE with SRVCC to 3G and 2G, HD and 

Ultra HD Voice (EVS), and CSFB to 3G and 2G

Wi-Fi

• Qualcomm® Wi-Fi 6-ready mobile platform

• Wi-Fi Standards: 802.11ax-ready, 802.11ac 

Wave 2, 802.11a/b/g, 802.11n 

• Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

• Channel Utilization: 20/40/80 MHz 

• MIMO Configuration: 2x2 (2-stream) 

• MU-MIMO

• Dual-band simultaneous (DBS)

• Key Features: 8x8 sounding (up to 2x 

improvement over 4x4 sounding devices), 

Target Wakeup Time for up to 67% better 

power efficiency, latest security with WPA3 

• Qualcomm® 60 GHz Wi-Fi mobile platform

• Wi-Fi Standards: 802.11ad, 802.11ay

• Wi-Fi Spectral Band: 60 GHz

• Peak speed: 10 Gbps