N-channel MOSFET to extend battery life in portable devices

Fairchild (Fairchild Semiconductor) in response to mobile phones, portable medical devices and media players and other portable applications and component design engineers in their design and efficient space-saving device by adding the demand, the introduction of N-channel MOSFET devices FDZ192NZ and FDZ372NZ The two devices use advanced PowerTrench process technology, with lower RDS (ON), higher efficiency and longer battery life.

Fairchild's FDZ192NZ and FDZ372NZ the industry's smallest , thinnest wafer-level chip size (wafer-level chip-scale, WL-CSP) package N-channel device. These devices through the use of advanced chip-scale packaging technology that dramatically save board space is critical to bring the advantages of portable applications.

These advanced WL-CSP MOSFET packaging technology marks a major breakthrough, so that devices can be integrated excellent heat transfer characteristics, ultra-thin packaging, low gate charge and low RDS (ON) characteristics, and that's as low as 1.5V can achieve the VGS RDS (ON) ratings. In addition, these devices also provide greater than 2200V for HBM ESD protection level.

FDZ192NZ with a thickness of only 0.65mm to 1.5mm x 1.0mm package; FDZ372NZ using 1.0mm x 1.0mm package, with industry leading 0.4mm thickness. Dimensions of 1.6mm x 1.6mm compared to the industry closest comparable devices, FDZ192NZ the volume is reduced by 41%; and FDZ372NZ is reduced by 61%, 40% reduction in height.

FDZ192NZ and FDZ372NZ Fairchild rich portfolio of advanced MOSFET part, these devices can address the market for charging, load switching, DC-DC boost applications and compact, thin, high-performance MOSFET devices demand.

author:Burmor,'s commentator

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